3D INLINE AOI
- Real 3D measurement of the surface of the PCB and its automatic evaluation
- A new dimension, where the clear indicator of quality of PCB assembly is a precisely measured surface with an unambiguous interpretation of measurements, and not a mere processing of 2D image using various algorithms
- AOI thus moves into the category of measuring equipment with the ability to automatically identify defects that are not detectable for common 2D systems.
- Resolution 15um
- 4 moire projection
- 4MPx high-speed camera
- Option of dual lane operation
3D SPI 8030-2
- SPI designed for common SMT production
- Online operation
- Resolution from 20 to 25um
- 2 moiré projections
- 4 MPx camera
- Inspection speed 0,45 sec/frame
Digital Microscope Vision Z2
- FULL HD camera with a resolution of 1920x1080px
- Magnification 1.8x – 50x (digitally up to 122x)
- Storing photo images via USB
- Working distance 250 mm
- Large field of view– up to 295 mm
- Automatic or manual treatment
- Adjustable LED lighting
- Image transmission to LCD through HDMI
- Robust stand with mounting
- Optional – external controller
Automated Optical Inspection Mirtec MV – 2HTL
- Detects soldering errors, reversed parts, missing parts, misplaced components, short circuits between the solder joints, checks SMD and thru-hole components
- 1,3Mpix camera
- Ability to store photos of found defects
Relay station IR- X410V
i
- Station for re-soldering of components in BGA housings
- Soldering is not performed by IR technologies
- Adjusting the course of warm up via PC
- Thanks to the technology of image overlap, the exact molding of BGA slots on PCB is possible
X-ray YXLON Y.Cougar
- Fast 2D and 3D microinspection
- Resolution < 1 um
- High speed flat-panel digital detector
- An open type of X-ray tube
- Product size: 440×550 mm
Monitoring system MANTIS
- Clear, undistorted, three-dimensional, colour and positionally accurately magnified.
Automated Optical
Inspection Mirtec MV-3 Series
- Detects soldering errors, reversed parts, missing parts, misplaced components, short circuits between the solder joints, checks SMD and thru-hole components
- Checks solder joints in the color spectrum
- 10 Mpix camera with a telecentric lens and 4 side cameras
- Laser measuring the height of components (BGA)
- Ability to store photos of found defects (SPC)
- Cycle time 11 sec
Automated Optical
Inspection Mirtec MV-3L
- Detects soldering errors, reversed parts, missing parts, misplaced components, short circuits between the solder joints, checks SMD and thru-hole components
- 5 Mpix camera with a telecentric lens and 4 side cameras
- Laser measuring the height of components (BGA)
- Ability to store photos of found defects (SPC)