Testing

3D INLINE AOI

  • Real 3D measurement of the surface of the PCB and its automatic evaluation
  • A new dimension, where the clear indicator of quality of PCB assembly is a precisely measured surface with an unambiguous interpretation of measurements, and not a mere processing of 2D image using various algorithms
  • AOI thus moves into the category of measuring equipment with the ability to automatically identify defects that are not detectable for common 2D systems.
  • Resolution 15um
  • 4 moire projection
  • 4MPx high-speed camera
  • Option of dual lane operation

3D SPI 8030-2

  • SPI designed for common SMT production
  • Online operation
  • Resolution from 20 to 25um
  • 2 moiré projections
  • 4 MPx camera
  • Inspection speed 0,45 sec/frame

Digital Microscope Vision Z2

  • FULL HD camera with a resolution of 1920x1080px
  • Magnification 1.8x – 50x (digitally up to 122x)
  • Storing photo images via USB
  • Working distance 250 mm
  • Large field of view– up to 295 mm
  • Automatic or manual treatment
  • Adjustable LED lighting
  • Image transmission to LCD through HDMI
  • Robust stand with mounting
  • Optional – external controller

Automated Optical Inspection Mirtec MV – 2HTL

  • Detects soldering errors, reversed parts, missing parts, misplaced components, short circuits between the solder joints, checks SMD and thru-hole components
  • 1,3Mpix camera
  • Ability to store photos of found defects

Relay station IR- X410Vi

  • Station for re-soldering of components in BGA housings
  • Soldering is not performed by IR technologies
  • Adjusting the course of warm up via PC
  • Thanks to the technology of image overlap, the exact molding of BGA slots on PCB is possible

X-ray YXLON Y.Cougar

  • Fast 2D and 3D microinspection
  • Resolution < 1 um
  • High speed flat-panel digital detector
  • An open type of X-ray tube
  • Product size: 440×550 mm

Monitoring system MANTIS

  • Clear, undistorted, three-dimensional, colour  and positionally accurately magnified.

Automated Optical
Inspection Mirtec MV-3 Series

  • Detects soldering errors, reversed parts, missing parts, misplaced components, short circuits between the solder joints, checks SMD and thru-hole components
  • Checks solder joints in the color spectrum
  • 10 Mpix camera with a telecentric lens and 4 side cameras
  • Laser measuring the height of components (BGA)
  • Ability to store photos of found defects (SPC)
  • Cycle time 11 sec

Automated Optical
Inspection Mirtec MV-3L

  • Detects soldering errors, reversed parts, missing parts, misplaced components, short circuits between the solder joints, checks SMD and thru-hole components
  • 5 Mpix camera with a telecentric lens and 4 side cameras
  • Laser measuring the height of components (BGA)
  • Ability to store photos of found defects (SPC)

 

 

 

Investment plan for 2016...

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Write to us

phone: +420 483 515 515
email: ems@jablopcb.cz